We have a rare opportunity for an experienced Principal Hardware Engineer / Team Lead with Line Management experience to lead the hardware development of a novel phased array antenna system. The candidate will be part of a dynamic London-based technology company developing complex and innovative products into the aerospace and land mobile industries.
With a background in communications, commercial aerospace or SatCom Engineering, the candidate will be required to lead the hardware development for the next generation of Ku/Ka phased array Antenna platforms. You will act as technical lead and mentor for a multidisciplinary team of hardware engineers working with Software, ASIC, Antenna, Mechanical, Manufacturing and Product Engineers to deliver complex mixed-signal, electronic PCB assemblies encompassing a variety of leading-edge communication technologies.
Location: London
Technical responsibilities
- Your primary role will be to act as technical lead of the hardware team developing the Aero platform to plan, design, verify, commission and productise board-level designs and sub-assemblies for Hanwha’s Phased Array Antenna products.
- To take ownership of the hardware development of complex mixed-signal RF, power and embedded based designs from requirements validation, architectural and sub-system design from hardware specifications, schematics, PCB layout, bring-up, commissioning, integration and verification into systems.
- Support the wider technical deliverables required for product development, such as lifecycle management, peer reviews, test equipment procurement and lab testing.
- Collaborate with members of the hardware, ASIC, software, systems, mechanical and operations teams to ensure effective support of the development programmes.
- Organise and manage hardware design reviews as appropriate with other engineering teams to ensure requirements are captured to ensure right first-time designs.
- Provide technical leadership to the team and mentoring in areas of specialist expertise.
- Support product design, software integration, validation and handover to production with other Engineering team members.
- Ensure the hardware is designed to meet EMC and regulatory approvals and the requirements for volume manufacturing (DFT/DFM) in line with industry best practise.
Organisational responsibilities
- Work with the Director of Hardware and other Engineering Leads across multiple disciplines to deliver multi-disciplinary product designs and delivery to tight timescales, communicating through plans, presentations and status reports.
- Contribute to the product development and planning process by the use of continuous improvement programs to provide time and effort estimates to project plans.
- Contribute to the company’s long-term goals by delivering right first-time hardware designs. Actively collaborates with other teams for the greater good.
- Demonstrated ability to deliver on-time and build good working relationships with cross-functional teams and external vendors, acting as a technical lead when required.
- Take responsibility for projects and delivery to tight timescales, communicating through plans, presentations and written reports.
- Contribute to hardware design reviews across the company when appropriate to ensure quality designs.
- The ability to analyse and make recommendations on the trade‐offs between performance, manufacturability, cost and user experience.
Essential qualifications and skills
- A good first or upper 2nd Class degree (BEng/MEng) in Electronic/Electrical Engineering from a leading University.
- At least 12 years’ experience in a relevant industry delivering technically complex products in the data communications, aerospace or automotive industry. At least 8 in a design role and 4 years in a lead position with line management experience.
- Demonstrated project management experience, technical lead and team leadership skills. Good understanding of a structured phased-gate product development process.
- A good understanding of the complete product development process preferably for high-reliability environments, namely aerospace, defence, land or marine products.
- Strong background in embedded system design or high frequency RF mixed signal, from concept, specification and design through to systems test, integration & manufacture.
- Experienced in the layout of complex high-speed multi-layer PCBs, stackup constraints and controlled impedance designs. Solid knowledge of high-speed design techniques.
- Familiar with schematic capture tools such as Altium Designer (essential) and industry standard tools for SI simulations (e.g. ADS, HyperLynx, HFSS, LTSPice).
- A strong leader, excellent communicator, mentor, creative with good problem-solving abilities. Able to take ownership of problems and finding solutions.
- Flexible can-do attitude. Able to adapt to a fast-moving environment
Desirable
- Designed products containing the STM32 family of MCUs would be a distinct advantage.
- Knowledge of the product approvals process for commercial aerospace (DO-160G) including emissions, susceptibility, environmental.
- Embedded software development experience in one the following C, C++, Python
- Practical experience in the use of test equipment such as scopes, logic analysers, spectrum analysers, signal generators, power meters.
London Technology Centre:
- Based in modern, open-plan offices in the vibrant area of Hatton Garden, with great views of the City of London from several spacious balconies with outdoor seating.
- Excellent transport connections: Farringdon, City Thameslink and Kings Cross St Pancras overground stations within walking distance; Chancery Lane and Farringdon tube stations within a five-minute walk.
- Showers, cycle racks, lockers and a coffee shop on site. Workspace networking and social events throughout the year.
- With the City, Covent Garden and Embankment close by, there's plenty to do at lunchtimes and after work.
- Leather Lane street food market is right on our doorstep, with the usual chains close by.